Low dielectric bonding film Alon Mighty AF-700 series
Excellent low dielectric properties and adhesion. For bonding high-speed transmission substrate materials such as mobile FPCs, including smartphones.
The "Alonmaitei AF-700 Series" is a thermosetting bonding film that boasts industry-leading low dielectric constant and low dielectric loss tangent. It can suppress transmission loss in the high-frequency range, making it suitable for electronic material applications. It is used in high-speed transmission substrate materials, such as flexible printed circuit boards (FPC) for mobile devices, including smartphones. It demonstrates excellent adhesion to difficult-to-bond substrates like polyimide and LCP, and offers good processability in FPC manufacturing. Customization is available upon request. 【Features】 ■ Low water absorption rate, maintaining high adhesion strength even in humid heat environments ■ Suitable as a bonding film for multilayer FPCs and adhesive layers for FCCL and coverlays ■ Also adopted for automotive millimeter-wave radar and antenna materials for base stations *For more details, please refer to the materials. Feel free to contact us with any inquiries.
- Company：東亞合成 新製品開発事業部 機能性接着剤部
- Price：Other
